| Replay: BCu92P: composition P :7.5-8 .5% copper: margin. A melting temperature of 710-750 ° C, the low melting point, the solder flow is good, but more brittle, generally used for brazing against impact loads, vibration-free copper and brass parts by welding;
2 BCu93P (HL201/BCuP-2): Ingredient P :6.80-7 .50%, Cu: balance. A melting temperature of 710-793 ° C, good fluidity of the solder may flow into the connector of a small gap, but the brazing material brittle, and generally used for electrical, mechanical and instrumentation industry, brazing copper and brass parts not subject to impact loads;
3, BCu89SnP (HL208): component P :6.80-7 .50% Sn 5.0 - 6.0%, Cu: balance. 620-660 ℃, melting temperature of the solder is a low melting point, good fluidity, with the silver brazing flux brazing of copper, brass, bronze, and low-zinc brass parts;
4, BCu86SnP: component P :4.80-5 .80%, tin :7.00-8.00%, nickel 0.40 to 1.20%, Cu: balance. Melting temperature of 620-670 ° C, The solder purposes above, nickel is added to make the increased brittleness, but the fluidity is improved, and bright, generally used for brazing of copper and brass weld |
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